Component placement systems and methods of operating the same

A component placement system comprising:

• a bond head including a first bond head array and a second bond head array, the first bond head array including a first plurality of pick up tools configured for simultaneously carrying a first plurality of electronic components, the first plurality of pick up tools being arranged in a linear configuration in the first bond head array, the second bond head array including a second plurality of pick up tools configured for simultaneously carrying a second plurality of electronic components, the second plurality of pick up tools being arranged in a linear configuration in the second bond head array;
• a support structure for carrying the bond head;
• a first motion system for moving the bond head along a first motion axis;
• a second motion system for moving the bond head along a second motion axis;
• a third motion system for moving the first bond head array independent of the second bond head array along the first motion axis;
• and
• a fourth motion system for moving the first bond head array independent of the second bond head array along the second motion axis.