Method for processing laminated wafer
AssigneeDisco Corporation
InventorsKokichi MINATO, Atsushi KOMATSU, Koichi MAKINO, Hironobu OZAWA
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Abstract
A method is for processing a laminated wafer in which a front surface side of a first wafer having an outer peripheral edge chamfered in an arc shape and a front surface side of a second wafer are joined. The method includes: removing a chamfered portion by applying an external force to the chamfered portion of the first wafer and separating the chamfered portion from the first wafer; and grinding another surface side opposite to the one surface side of the first wafer after removing the chamfered portion.
Claims7
A method for processing a laminated wafer in which one surface side of a first wafer having an outer peripheral edge chamfered in an arc shape and one surface side of a second wafer are joined together, the method comprising:
- removing a chamfered portion by applying an external force to the chamfered portion of the first wafer and separating the chamfered portion from the first wafer;
- and
- grinding another surface side opposite to the one surface side of the first wafer after removing the chamfered portion.
Dependencies are inferred from the claim text.