Memory devices with a backside read bit line
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsPing-Wei Wang, Feng-Ming Chang, Jui-Lin Chen, Yu-Bey Wu
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AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsPing-Wei Wang, Feng-Ming Chang, Jui-Lin Chen, Yu-Bey Wu
Estimating the term…
Semiconductor structures and methods are provided. An exemplary semiconductor structure according to the present disclosure includes a two-port static random access memory (SRAM) cell having a write port portion and a read port portion electrically coupled to the write port portion. The read port portion includes a transistor having a first source/drain feature and a second source/drain feature. The semiconductor structure also includes a first plurality of metal lines comprising a write bit line and a complementary write bit line, wherein the first plurality of metal lines are positioned at a first metal interconnect layer, wherein the first metal interconnect layer is disposed over the first source/drain feature. The semiconductor structure also includes a read bit line positioned at a second metal interconnect layer, where the second metal interconnect layer is disposed under the first source/drain feature.
A semiconductor structure, comprising:
A semiconductor structure, comprising:
A semiconductor structure, comprising:
Dependencies are inferred from the claim text.