Universal ruggedized computer enclosure with forced air and external mist cooling

A method of cooling an enclosure device for a printed circuit board (PCB), the method comprising:

• enclosing, with an enclosure wall structure, an enclosure interior which has a PCB space in which to dispose the PCB, the enclosure wall structure including therein an internal geometry of a monolithic heat exchanger core of a monolithic heat exchanger having a plurality of internal channels, the enclosure wall structure including one or more vents;
• driving air via one or more inlets from an enclosure exterior outside of the enclosure wall structure through the internal channels and out of the one or more vents;
• and
• delivering a misting fluid via a plurality of misters disposed at a plurality of misting locations external of the enclosure wall structure for cooling an exterior of the enclosure wall structure.

A method of cooling an enclosure device for a printed circuit board (PCB), the method comprising:

• enclosing, with an enclosure wall structure, an enclosure interior which has a PCB space in which to dispose the PCB, the enclosure wall structure including therein an internal geometry of a monolithic heat exchanger core of a monolithic heat exchanger having a plurality of internal channels, the enclosure wall structure including one or more vents;
• driving air via one or more inlets from an enclosure exterior outside of the enclosure wall structure through the internal channels and out of the one or more vents;
• flowing a gallium liquid inside a gallium tube forming a gallium loop in the enclosure device to cool the air around the gallium tube in the enclosure device;
• and
• actively cooling the liquid gallium in the gallium loop on demand based on a temperature inside the enclosure device.