Mitigating fiber weave effect in a printed circuit board

A method of mitigating fiber weave effect, comprising:

• obtaining a laminate sheet, the laminate sheet including a fiber weave of fibers extending in a direction between a first side of the laminate sheet and a second side of the laminate sheet, the first side of the laminate sheet opposite to the second side of the laminate sheet;
• obtaining a cut laminate sheet from the laminate sheet, the laminate sheet including a first side and a second side opposite to the first side, the obtaining including:
• marking a first cutting line between the first side and the second side of the laminate sheet, the first cutting line at an angle with respect to the direction of the fibers of the laminate sheet;
• marking a second cutting line between the first side and the second side of the laminate sheet, the second cutting line spaced-apart from the first cutting line and parallel to the first cutting line;
• marking a third cutting line extending between the first and the second cutting lines, the third cutting line perpendicular to the first and the second cutting lines;
• marking a fourth cutting line extending between the first and the second cutting lines, the fourth cutting line spaced-apart from the third cutting line and parallel to the third cutting line;
• cutting the laminate sheet at the first, second, third, and fourth cutting lines to form first, second, third, and four sides, respectively, of the cut laminate sheet;
• positioning a printed circuit board (PCB) design image in superimposition with the cut laminate sheet;
• rotating the cut laminate sheet such that each of the sides of the cut laminate sheet are aligned with a respective side of the PCB design image;
• and
• forming the PCB on the cut laminate sheet based on the rotation of the cut laminate sheet with respect to the PCB design image and the alignment between the cut laminate sheet and the PCB design image.