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AssigneeInternational Business Machines Corporation
InventorsLawrence A. Clevenger, Dan Moy, JENS HAETTY, Christopher Murphy, Ruilong Xie, Nicholas Anthony Lanzillo, Huai Huang, Hosadurga Shobha, Atharv Jog
Estimating the term…
A semiconductor integrated circuit (IC) device includes a backside fuse structure and a backside contact. The backside fuse structure is located within the backside of the semiconductor IC device vertically between a transistor there above and a backside back end of the line (BEOL) network. The backside fuse structure includes a fuse wire and a deep via contact that is connected to both the fuse wire and to a frontside BEOL network. The backside contact is connected to the transistor, to the backside BEOL network, and to the fuse wire. The backside fuse structure may be in a non-programmed state or a programmed state. When in a non-programmed state, an open circuit exists that prevents current flow through the fuse wire or through the backside contact.
A semiconductor integrated circuit (IC) device comprising:
A semiconductor integrated circuit (IC) device method comprising:
A semiconductor integrated circuit (IC) device method comprising:
Dependencies are inferred from the claim text.