Thermal management system for multiple dies

A thermal management system for electronic device, comprising:

• a circuit board;
• a first die and a second die, wherein the first die and the second die are laterally adjacent to each other and connected to the circuit board;
• a side-channel between the first die and the second die, wherein the side-channel acts as an insulating layer;
• and
• one or more thermal elements on top of the first die and the second die.

A thermal management system for electronic device, comprising:

• a circuit board;
• a first die and a second die, wherein the first die and the second die are laterally adjacent to each other and connected to the circuit board;
• a first inlet for the first die configured to receive a first working fluid at a first temperature;
• and
• a second inlet for the second die configured to receive a second working fluid at a second temperature, and wherein the first temperature and the second temperature are different.