Back to results
US 2025/0096067 A1Published application
Thermal buffering electrical interconnects
AssigneeU.S. Army DEVCOM Army Research Laboratory
InventorsMichael C. Fish, Rachel C. McAfee
Life of this patent
Estimating the term…
Abstract
We disclose novel thermal buffering electrical interconnects. They are formed of an electrical circuit which generates heat; and a composite electrically connected to the circuit and comprising a porous scaffold having a phase change material (PCM) at least partially filling the porous space of the scaffold jointly capable of carrying an electric current. The PCM-filled porous scaffold is electrically conductive.
Claims20
A thermal buffering electrical interconnect comprising:
- an electrical circuit which generates heat;
- and
- a composite electrically connected to the circuit and comprising a porous scaffold having a phase change material (PCM) at least partially filling the porous space of the scaffold jointly capable of carrying an electric current,
- wherein the PCM-filled porous scaffold is electrically conductive.
1 more element
A thermal buffering electrical interconnect comprising:
- a first electrode contact;
- an electrical circuit which generates heat electrically connected to the first contact;
- a composite electrically connected to the circuit and comprising an electrically conductive porous scaffold having an electrically conductive phase change material (PCM) at least partially filling the porous space of the scaffold, wherein the melting point of the metal PCM is selected to be below the maximum safe operating temperature of the circuit;
- and
- a second electrode contact electrically connected to the metal-filled porous scaffold.
2 more elements
Dependencies are inferred from the claim text.