Semiconductor manufacturing apparatus and method of manufacturing a semiconductor device

A method of manufacturing of a semiconductor device comprising:

• accommodating the wafer in a first portion of a chamber that is sealed off from a second portion of the chamber by a movable shutter;
• supplying a silylating agent to the wafer accommodated in the first portion while the first portion is sealed off from the second portion;
• controlling the pressure difference between the first portion and a second portion of the chamber such that the pressure of the second portion is equal to or higher than the pressure of the first portion;
• moving the shutter to open a space between the first and second portions while the pressure of the second portion is maintained to be equal to or higher than the pressure of the first portion;
• and
• moving the wafer through the space from the first portion to the second portion.