Microelectronic devices including slit structures, and related memory devices
AssigneeMicron Technology, Inc.
InventorsCollin Howder, Justin D. Shepherdson, Chet E. Carter
Life of this patent
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AssigneeMicron Technology, Inc.
InventorsCollin Howder, Justin D. Shepherdson, Chet E. Carter
Estimating the term…
A microelectronic device may include a source structure and a stack structure. The stack structure may include a vertically alternating sequence of insulative structures and conductive structures. Filled slits may extend through the stack structure and into the source structure, the slits dividing the stack structure into multiple blocks. Memory cell pillars may extend through the stack structure and into the source structure, the memory cell pillars and the filled slits terminated at substantially the same depth within the source structure as one another.
A microelectronic device, comprising:
A memory device, comprising:
A 3D NAND Flash memory device, comprising:
Dependencies are inferred from the claim text.