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US 2025/0029865 A1Published application
Wafer clamping method and semiconductor manufacturing apparatus
AssigneeNissin Ion Equipment Co., Ltd.
InventorsTakayuki MURAYAMA, Yuya HIRAI, Weijiang ZHAO
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Abstract
A semiconductor manufacturing apparatus includes a wafer clamp including a mechanical clamp and an electrostatic chuck, and a controller that controls the wafer clamp to selective clamp a wafer using only the mechanical clamp based on a processing temperature of a wafer.
Claims20
A wafer clamping method used in semiconductor manufacturing apparatus with a wafer clamp including a mechanical clamp and an electrostatic chuck, the wafer clamping method comprising:
- selectively clamping a wafer using only the mechanical clamp of the wafer clamp, based on a processing temperature of the wafer.
A semiconductor manufacturing apparatus comprising:
- a wafer clamp including a mechanical clamp and an electrostatic chuck,
- a controller that controls the wafer clamp to selectively clamp a wafer using only the mechanical clamp, based on a processing temperature of the wafer.
Dependencies are inferred from the claim text.