Temporary substrate carriers
AssigneeSemiconductor Components Industries, LLC
InventorMichael J. SEDDON
Life of this patent
Estimating the term…
Abstract
Implementations of a substrate carrier may include a frame including an inner perimeter, the inner perimeter configured to be smaller than a perimeter of an organic substrate panel including multiple semiconductor die coupled thereto; and an outer perimeter configured to be larger than the perimeter of the organic substrate panel; wherein an edge of the frame between the inner perimeter and outer perimeter may be configured to rest against the organic substrate panel to prevent warpage during a heating operation.
Claims20
A substrate carrier comprising:
- a frame comprising an inner perimeter, the inner perimeter configured to be smaller than a perimeter of an organic substrate panel comprising multiple semiconductor die coupled thereto;
- and
- an outer perimeter configured to be larger than the perimeter of the organic substrate panel;
- wherein an edge of the frame between the inner perimeter and outer perimeter is configured to rest against the organic substrate panel to prevent warpage during a heating operation.
A substrate carrier comprising:
- a frame comprising an inner surface and an outer surface and a shoulder comprised in the inner surface;
- wherein the shoulder of the frame is configured to contact an organic substrate panel comprising multiple semiconductor die coupled thereto in order to prevent warpage during a heating operation.
A substrate carrier comprising:
- a first frame comprising an inner surface and an outer surface and a first shoulder comprised in the inner surface;
- a second frame comprising an inner surface and an outer surface and a second shoulder comprised in the inner surface;
- and
- two or more couplers holding the first frame to the second frame;
- wherein when the two or more couplers hold the first frame to the second frame, the first shoulder of the first frame and the second shoulder of the second frame are configured to contact an organic substrate panel comprising multiple semiconductor die coupled thereto in order to prevent warpage during a heating operation.
Dependencies are inferred from the claim text.