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US 2025/0026960 A1Published application
Polishing slurry composition
AssigneeKctech Co., Ltd.
InventorsBo Hyeok CHOI, Hyun Goo KONG, Ji Hye KIM
Life of this patent
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Abstract
The present invention relates to a polishing slurry composition, and more specifically to a polishing slurry composition for polysilicon polishing, the composition comprising: colloidal silica abrasive particles; a quaternary ammonium cationic monomer; and an acidic material.
Claims15
A polishing slurry composition for polishing polycrystalline silicon, the polishing slurry composition comprising:
- colloidal silica abrasive particles;
- a quaternary ammonium cationic monomer;
- and
- an acidic material.
1 more element
Dependencies are inferred from the claim text.