Back to results
US 2024/0402597 A1Published application
Metamaterial and laminate
AssigneeFUJIFILM Corporation
InventorYasuyuki SASADA
Life of this patent
Estimating the term…
Abstract
Provided are a metamaterial including a base material having a dielectric loss tangent of 0.01 or less and a pattern provided on a surface of the base material, in which the pattern is composed of at least one of a conductive material or a material which transits from an insulator to a conductor, and a thermal expansion coefficient of the base material is 80 ppm/K or less; and a laminate including the metamaterial.
Claims10
A metamaterial comprising:
- a base material;
- and
- a pattern provided on a surface of the base material,
- wherein the pattern is composed of at least one of a conductive material or a material which transits from an insulator to a conductor, and
- a thermal expansion coefficient of the base material is 80 ppm/K or less.
2 more elements
Dependencies are inferred from the claim text.