Heatsink chassis with aerofoil
AssigneeRakuten Symphony UK Ltd
InventorGerard MacManus
Life of this patent
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Abstract
A chassis is provided for a circuit board, the chassis having a heatsink. The chassis includes a plurality of fins extending from the chassis for extracting heat from electronics mounted on the chassis. The plurality of fins are organized into at least two fin sections, wherein a first fin section has a first set of fins of the plurality of fins and a second fin section has a second set of fins of the plurality of fins. The chassis further provides a thermal break between the first fin section and the second fin section, the thermal break being an air gap between the first set of fins and the second set of fins. An aerofoil is then fixed in the air gap and inhibits air flow between the first fin section and the second fin section.
Claims18
A chassis for a circuit board having a heatsink, the chassis comprising:
- a plurality of fins extending from the chassis for extracting heat from electronics mounted on the chassis, the plurality of fins being organized into at least two fin sections, wherein a first fin section of the at least two fin sections comprises a first set of fins of the plurality of fins and a second fin section of the at least two fin sections comprises a second set of fins of the plurality of fins;
- a thermal break between the first fin section and the second fin section, the thermal break being an air gap between the first set of fins and the second set of fins;
- and
- an aerofoil fixed in the air gap and inhibiting air flow between the first fin section and the second fin section.
Dependencies are inferred from the claim text.