Display panel and splicing screen including the same

A display panel, comprising:

• a circuit substrate, comprising an installation area and a connection area disposed at intervals, and provided with a wiring through-hole defined at the connection area and a groove defined at the installation area;
• a connection wiring, disposed in the wiring through-hole;
• a substrate, disposed on a side of the circuit substrate, and disposed in the groove;
• a display assembly, disposed on a side of the substrate away from the circuit substrate, and comprising a driving circuit layer;
• a chip on film, disposed on a side of the circuit substrate away from the substrate;
• a fan-out part, disposed between the circuit substrate and the chip on film, wherein the fan-out part comprises a plurality of fan-out wirings, and an end of the fan-out wirings is connected to the chip on film;
• and
• a connection part, disposed on a side of the circuit substrate close to the driving circuit layer and located at the connection area;
• wherein the driving circuit layer comprises a first connection terminal close to the connection area, and the circuit substrate comprises a second connection terminal disposed on a side of the circuit substrate close to the driving circuit layer and located at the connection area;
• the first connection terminal and the second connection terminal are disposed on a same layer and at intervals, and connected to each other through the connection part, the second connection terminal is connected to a first end of the connection wiring, and a second end of the connection wiring is connected to another end of the fan-out wirings through the wiring through-hole.

A splicing screen, comprising at least two display panels, each of the display panels comprises:

• a circuit substrate, comprising at least one installation area and at least one connection area, and provided with a wiring through-hole defined at the connection area, wherein one installation area is spaced with adjacent one connection area;
• at least one substrate, disposed on a side of the circuit substrate, and located at the installation area;
• at least one display assembly, disposed on a side of the substrate away from the circuit substrate, and comprising a driving circuit layer;
• at least one chip on film, disposed on a side of the circuit substrate away from the substrate;
• at least one fan-out part, disposed between the circuit substrate and the chip on film, wherein the fan-out part comprises a plurality of fan-out wirings, and an end of the fan-out wirings is connected to the chip on film;
• and
• at least one group of connection wiring, wherein a first end of the connection wiring is connected to the driving circuit layer, and a second end of the connection wiring is connected to another end of the fan-out wirings through the wiring through-hole.