Separated heat dissipating device having suspension mechanism and optical module system thereof

An optical module system, comprising:

• an optical module device configured to be mounted on a circuit board;
• and
• a separated heat dissipating device configured to be assembled with the optical module device and comprising:
• at least one heat dissipating module, having a first lateral surface configured to abut against a surface of an electronic device and a second lateral surface disposed with at least one first mounting member;
• and
• at least one suspension mechanism, configured to be mounted on the second lateral surface of the heat dissipating module, and comprising:
• at least one elastic element configured to be sleeved around the first mounting member of the heat dissipating module;
• a fixing plate formed with at least one through hole configured to allow passage of the first mounting member and allow the elastic element to be located between the heat dissipating module and the fixing plate;
• and
• at least one second mounting member configured to be assembled with the first mounting member,
• wherein the heat dissipating module moves towards the fixing plate and compresses the elastic element when a surface of the heat dissipating module is applied with a force.