System-in-package module and method for manufacturing the same

Abstract

A method for manufacturing a system-in-package module includes providing a carrier plate; mounting a plurality of electronic components on the carrier plate, wherein the plurality of electronic components are electrically connected to the carrier plate; providing a plastic encapsulation film which comprises a resin and an inorganic filler; providing an electromagnetic shielding film; pressing the electromagnetic shielding film and the plastic encapsulation film into a composite structure; and pressing the composite structure onto the carrier plate, wherein the plastic encapsulation film is in contact with and covers a surface of the carrier plate and encapsulates the plurality of electronic components. A system-in-package module is also disclosed.

Dependencies are inferred from the claim text.