Semiconductor device package and method for manufacturing the same
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsZheng Wei WU, Cheng Kai CHANG
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Abstract
The present disclosure provides a semiconductor device package. The semiconductor device package includes a substrate having a first surface, an electrical contact disposed over a first region of the substrate, and an EMI shielding layer disposed over the substrate. The EMI shielding layer includes a non-uniform thickness and an elevation of the EMI shielding layer is higher than an elevation of the electrical contact with respect to the first surface of the substrate. A method for manufacturing a semiconductor device package is also disclosed.
Claims20
A semiconductor device package, comprising:
- a substrate having a first surface;
- an electrical contact disposed over a first region of the substrate;
- an EMI shielding layer disposed over the substrate, wherein the EMI shielding layer comprises a non-uniform thickness and an elevation of the EMI shielding layer is higher than an elevation of the electrical contact with respect to the first surface of the substrate.
A semiconductor device package, comprising:
- a substrate having a first surface;
- a grounding element exposed from the first surface of the substrate;
- and
- an EMI shielding layer disposed over the first surface of the substrate, wherein at least a part of the EMI shielding layer comprises a non-uniform thickness and in contact with the grounding element.
A method for manufacturing a semiconductor device package, comprising:
- providing a mask structure to cover at least a portion of a predetermined shielding region of a substrate;
- and
- forming an EMI shielding layer between the mask structure and the at least portion of the predetermined shielding region of the substrate.
Dependencies are inferred from the claim text.