Back to results
US 2024/0186211 A1Published application
Direct-cooling for semiconductor device modules
AssigneeSemiconductor Components Industries, LLC
InventorsJooyang EOM, Inpil YOO, Seungwon IM, Byoungok LEE
Life of this patent
Estimating the term…
Abstract
In a general aspect, an apparatus includes a substrate and a metal layer disposed on a surface of the substrate. The apparatus also includes a first recess and a second recess formed in the metal layer, and a folded cooling fin. A first portion of the folded cooling fin is disposed within the first recess and coupled with the metal layer, and a second portion of the folded cooling fin is disposed in the second recess and coupled with the metal layer.
Claims20
An apparatus, comprising:
- a substrate;
- a metal layer disposed on a surface of the substrate;
- a first recess formed in the metal layer;
- a second recess formed in the metal layer;
- and
- a folded cooling fin,
- a first portion of the folded cooling fin being disposed within the first recess and coupled with the metal layer, and
- a second portion of the folded cooling fin being disposed within the second recess and coupled with the metal layer.
5 more elements
An apparatus, comprising:
- a substrate;
- a semiconductor die coupled with a first surface of the substrate;
- a metal layer disposed on a second surface of the substrate, the second surface being opposite the first surface;
- a first recess formed in the metal layer;
- a second recess formed in the metal layer;
- and
- a folded cooling fin coupled with the metal layer, a first portion of the folded cooling fin being disposed within the first recess, and a second portion of the folded cooling fin being disposed within the second recess.
4 more elements
A method comprising:
- forming, in a metal layer disposed on a substrate, a recess;
- depositing a thermally conductive adhesive in the recess;
- placing a cooling fin in the thermally conductive adhesive, such that a portion of the cooling fin is disposed in the thermally conductive adhesive disposed in the recess;
- and
- curing the thermally conductive adhesive to couple the cooling fin with the metal layer.
2 more elements
Dependencies are inferred from the claim text.