Package substrate and manufacturing method therefor

Abstract

A package substrate includes a first dielectric layer, a first line layer provided on the first dielectric layer, the first line layer including a dam, a second dielectric layer provided on the first dielectric layer and covering the first line layer, a component embedded in the second dielectric layer and surrounded by the dam, and a third dielectric layer provided on the second dielectric layer and covering the component. By providing the dam, it can ensure a good bonding force between dielectric layers by using the dam to effectively avoid an offset problem of the components when the same is embedded in the second dielectric layer as well as omitting a step of baking roughening.

Dependencies are inferred from the claim text.