Photomask design correction method
AssigneeUnited Microelectronics Corp.
InventorsMin Cheng Yang, Wei Cyuan Lo, Yung-Feng Cheng
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AssigneeUnited Microelectronics Corp.
InventorsMin Cheng Yang, Wei Cyuan Lo, Yung-Feng Cheng
Estimating the term…
A photomask design correction method is provided. The photomask design correction method includes the following steps. A layer information data is provided. An OPC process is performed on the layer information data to obtain a first photomask data. A photomask is fabricated based on the first photomask data. A pattern information data of the photomask is obtained after the photomask is fabricated. The difference between the pattern information data and a database of the OPC process is analyzed. An OPC model of the OPC process is corrected based on the difference to obtain a corrected OPC model. The OPC process is performed using the corrected OPC model on the layer information data to obtain a second photomask data.
A photomask design correction method, comprising:
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