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US 2023/0156966 A1Published application
Element-mounted board and method for manufacturing element-mounted board
AssigneeDenka Company Limited
InventorsDaisuke GOTO, Hiroaki OTA
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Abstract
An element-mounted board includes a heat-dissipating plate in which aluminum or magnesium-containing metal layers are formed on both front and back surfaces of a flat plate-shaped metal-silicon carbide complex including aluminum or magnesium, and an electronic element including a ceramic plate, which is mounted on one surface side of the heat-dissipating plate, in which a flatness of the other surface of the heat-dissipating plate is 600 μm or less.
Claims7
An element-mounted board comprising:
- a heat-dissipating plate in which aluminum or magnesium-containing metal layers are formed on both front and back surfaces of a flat plate-shaped metal-silicon carbide complex including aluminum or magnesium;
- and
- an electronic element including a ceramic plate, which is mounted on one surface side of the heat-dissipating plate,
- wherein a flatness of the other surface of the heat-dissipating plate is 600 μm or less.
1 more element
Dependencies are inferred from the claim text.