Substrate heating apparatus with enhanced temperature uniformity characteristic

Abstract

The present disclosure discloses a substrate heating apparatus for heating a substrate, wherein the substrate heating apparatus includes: a body including a substrate seating portion on which the substrate is seated, to support the substrate; a first heating element located in an inner region of the body; a second heating element located in an outer region surrounding the inner region; a third heating element configured to transmit current to the second heating element across the inner region of the body; and a connecting member electrically interconnecting the second heating element and the third heating element, wherein the connecting member is made of a molybdenum-tungsten alloy containing molybdenum and tungsten.

Dependencies are inferred from the claim text.