Bit cell with back-side metal line device and method

An integrated circuit (IC) comprising:

• a substrate having a front side and a back side;
• a one-time-programmable (OTP) bit cell comprising a program transistor, the program transistor comprising:
• a first portion of an active area that extends in a first direction;
• and
• a first gate that extends in a second direction and intersects the first portion of the active area;
• a first metal line on the front side of the substrate electrically connected to one of the active area or the first gate;
• and
• a second metal line on the back side of the substrate electrically connected to the other of the active area or the first gate.

A method of manufacturing a one-time-programmable (OTP) bit, the method comprising:

• fabricating a program transistor and a first read transistor comprising respective first and second portions of an active area on a front side of a substrate;
• constructing a via from a back side of the substrate to one of a gate of the program transistor, a gate of the first read transistor, or the active area;
• and
• constructing a metal line in a back-side metal layer, the metal line and the via thereby being included in an electrical connection to the one of the gate of the program transistor, the gate of the first read transistor, or the active area.