Staged cooling for secondary coolant in datacenter cooling systems
AssigneeNVIDIA Corporation
InventorAli Heydari
Life of this patent
Estimating the term…
Abstract
Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, a hybrid coolant distribution unit (HCDU) provides first stage cooling of secondary coolant returning from at least one cold plate in a liquid to air heat exchanger (L2AHE) and provides second stage cooling in a liquid to liquid heat exchanger (L2LHE) for secondary coolant exiting an L2AHE using varying flow rates of a primary coolant based in part on a residual temperature that is determined for such secondary coolant exiting an L2AHE.
Claims20
A datacenter cooling system, comprising:
- a hybrid coolant distribution unit (HCDU) comprising a liquid to air heat exchanger (L2AHE) and a liquid to liquid heat exchanger (L2LHE), the L2AHE to provide first stage cooling of secondary coolant returning from at least one cold plate, and the L2LHE to provide second stage cooling for the secondary coolant exiting the L2AHE using varying flow rates of a primary coolant, the varying flow rates based in part on a residual temperature determined for the secondary coolant exiting the L2AHE.
A processor comprising one or more circuits and associated with a hybrid coolant distribution unit (HCDU) having a liquid to air heat exchanger (L2AHE) and a liquid to liquid heat exchanger (L2LHE), the one or more circuits to determine a residual temperature for a secondary coolant exiting an L2AHE, the L2AHE to provide first stage cooling of secondary coolant returning from at least one cold plate, the processor to cause the L2LHE to provide second stage cooling for the secondary coolant exiting the L2AHE using varying flow rates of a primary coolant based in part on the residual temperature.
A method for datacenter cooling system, comprising:
- providing a hybrid coolant distribution unit (HCDU) comprising a liquid to air heat exchanger (L2AHE) and a liquid to liquid heat exchanger (L2LHE);
- determining cooling requirements for at least one computing device;
- enabling the L2AHE to provide first stage cooling of secondary coolant returning from at least one cold plate;
- and
- enabling the L2LHE to provide second stage cooling for the secondary coolant exiting the L2AHE using varying flow rates of a primary coolant, the varying flow rates based in part on a residual temperature determined for the secondary coolant exiting the L2AHE.
Dependencies are inferred from the claim text.