Semiconductor storage device and method for manufacturing the same
AssigneeKioxia Corporation
InventorsKazuharu YAMABE, Yoshiro SHIMOJO
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AssigneeKioxia Corporation
InventorsKazuharu YAMABE, Yoshiro SHIMOJO
Estimating the term…
In a method for manufacturing a memory, a first stacked body is formed by stacking a first insulating film and a first sacrificial film. A first columnar body including a first semiconductor portion extending in the first stacked body in the first direction and a charge trapping film provided on an outer peripheral surface of the first semiconductor portion is formed. A second columnar body provided in a second direction of the first columnar body and including a second semiconductor portion stretching in the first stacked body in the first direction and a charge trapping film on an outer peripheral surface of the second semiconductor portion is formed. A second insulating film is formed above the first stacked body. A third columnar body including a third semiconductor portion provided on both the first columnar body and the second columnar body and stretching in the second insulating film in the first direction and a first gate insulating film provided on an outer peripheral surface of the third semiconductor portion is formed. A first division insulating film extending in the first direction and a third direction intersecting the first direction and the second direction and dividing the third semiconductor portion of the third columnar body in the second direction is formed.
A method for manufacturing a semiconductor storage device, the method comprising:
A semiconductor storage device, comprising:
Dependencies are inferred from the claim text.