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US 2022/0037208 A1Published application
Method for manufacturing electronic device
AssigneeSharp Kabushiki Kaisha
InventorMAYUKO SAKAMOTO
Life of this patent
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Abstract
A method for manufacturing an electronic device includes the following: forming an island-shaped peeling layer onto a substrate; stacking a resin layer all over the peeling layer; forming a barrier layer over the resin layer; forming an electronic-circuit layer onto the upper surface of the barrier layer; and peeling off the resin layer from the substrate and the peeling layer.
Claims15
A method for manufacturing an electronic device, comprising the steps of:
- first film-formation comprising forming a peeling layer having an island shape onto a motherboard;
- second film-formation comprising stacking a resin layer over at least a part of the peeling layer;
- third film-formation comprising forming a barrier layer over the resin layer;
- fourth film-formation comprising forming an electronic-circuit layer onto an upper surface of the barrier layer;
- and
- peeling off the resin layer from the motherboard and the peeling layer by irradiating the peeling layer and the resin layer with light.
3 more elements
Dependencies are inferred from the claim text.