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US 2022/0033973 A1Published application
Electroless palladium plating bath
AssigneeC. Uyemura & Co., Ltd.
InventorsTakuma MAEKAWA, Katsuhisa TANABE, Toshiaki SHIBATA
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Abstract
A plating bath at least contains a palladium compound, a reducing agent, a complexing agent, and a stabilizer. The stabilizer is an organic compound in which a divalent sulfur compound is bonded to a compound with a heterocyclic structure, and the organic compound contains neither a thiol group nor a disulfide bond.
Claims5
An electroless palladium plating bath at least comprising:
- a palladium compound;
- a reducing agent;
- a complexing agent;
- and a stabilizer,
- the stabilizer being an organic compound in which a divalent sulfur compound is bonded to a compound with a heterocyclic structure, the organic compound containing neither a thiol group nor a disulfide bond.
2 more elements
Dependencies are inferred from the claim text.