Lithography support cleaning with cleaning substrate having controlled geometry and composition
AssigneeASML Holding N.V.
InventorsKeane Michael LEVY, Akshay HARLALKA
Life of this patent
Estimating the term…
Abstract
Apparatus for and method of removing a contaminant from a working surface of a lithography support such as a reticle or wafer stage in an EUV or a DUV photolithography system in which a cleaning substrate provided with a coating made a selected material and configuration is pressed against the working surface so that the contaminant is transferred from the working surface to the coating.
Claims30
1-29. (canceled)
An apparatus comprising:
- a clamping structure comprising a working surface;
- and
- a cleaning substrate configured to remove a contaminant from the working surface, the cleaning substrate comprising:
- a base having a lateral surface;
- and
- a coating on at least part of the lateral surface.
A cleaning substrate for removing particles of a contaminant comprising a first material from a working surface comprising a second material, the cleaning substrate comprising:
- a base having a lateral surface;
- and
- a coating on at least part of the lateral surface, the coating comprising a third material,
- wherein a bond dissociation energy of a bond between the first material and the second material is less than a bond dissociation energy of a bond between the second material and the third material.
A method of removing a contaminant comprising:
- pressing a cleaning substrate against a working surface of a clamping structure in a photolithography tool, the cleaning substrate comprising a base having a lateral surface and a coating on at least part of the lateral surface;
- and
- moving the cleaning substrate away from the working surface to remove the contaminant from the working surface.
A method of removing particles of a contaminant comprising a first material from a working surface comprising a second material, the method comprising:
- pressing a cleaning substrate against the working surface, the cleaning substrate comprising a base having a lateral surface and a coating on at least part of the lateral surface, the coating comprising a third material, wherein a bond dissociation energy of a bond between the first material and the second material is less than a bond dissociation energy of a bond between the second material and the third material, such that the contaminant transfers from the working surface to the coating;
- and
- moving the cleaning substrate away from the working surface to remove the contaminant from the working surface.
A method of removing a contaminant from a working surface comprising:
- pressing a first cleaning substrate against a first portion of the working surface, the cleaning substrate comprising a base having a lateral surface and a first coating on at least part of the lateral surface and having a lateral size and shape corresponding to a size and shape of the first portion, so that the contaminant transfers from the first portion to the first coating;
- moving the first cleaning substrate away from the working surface to remove the contaminant from the first portion of the working surface;
- pressing a second cleaning substrate against a second portion of the working surface, the second cleaning substrate comprising a base having a lateral surface and a second coating on at least part of the lateral surface and having a lateral size and shape corresponding to a size and shape of the second portion, so that the contaminant transfers from the second portion to the second coating;
- and
- moving the second cleaning substrate away from the working surface to remove the contaminant from the second portion of the working surface.
A method of removing particles of a contaminant comprising a first material from a working surface comprising a second material, the method comprising:
- pressing a first cleaning substrate against a first portion of the working surface, the cleaning substrate comprising a base having a lateral surface and a first coating on at least part of the lateral surface and having a lateral size and shape corresponding to a size and shape of the first portion, the first coating comprising a third material, wherein a bond dissociation energy of a bond between the first material and the second material is less than a bond dissociation energy of a bond between the second material and the third material, so that the contaminant transfers from the first portion to the first coating;
- moving the first cleaning substrate away from the working surface to remove the contaminant from the first portion of the working surface;
- pressing a second cleaning substrate against a second portion of the working surface, the second cleaning substrate comprising a base having a lateral surface and a second coating on at least part of the lateral surface and having a lateral size and shape corresponding to a size and shape of the second portion, the second coating comprising a third material, wherein a bond dissociation energy of a bond between the first material and the second material is less than a bond dissociation energy of a bond between the second material and the third material, so that the contaminant transfers from the second portion to the second coating;
- and
- moving the second cleaning substrate away from the working surface to remove the contaminant from the second portion of the working surface.
Dependencies are inferred from the claim text.