Method for producing damper structures on a micromechanical wafer
AssigneeRobert Bosch GmbH
InventorMichael Stumber
Life of this patent
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Abstract
A method for producing damper structures on a micromechanical wafer. The method includes: (A) providing an edge adhesive film and a molding wafer, which includes a first side having a molding structure; (B) applying the edge adhesive film to the first side of the molding wafer at a low atmospheric pressure; (C) joining the edge adhesive film to the first side of the molding wafer by increasing the atmospheric pressure; (D) filling the molding structures with an adhesive; (E) curing the adhesive to form damper structures; (F) bonding the damper structures to a second side of a micromechanical wafer.
Claims7
1-6. (canceled)
A method for producing damper structures on a micromechanical wafer, comprising the following steps:
- (A) providing an edge adhesive film, and a molding wafer which includes a first side having a molding structure;
- (B) applying the edge adhesive film to the first side of the molding wafer at a low atmospheric pressure;
- (C) joining the edge adhesive film to the first side of the forming wafer by increasing the atmospheric pressure;
- (D) filling the molding structure with an adhesive;
- (E) curing the adhesive to form damper structures;
- and
- (F) bonding the damper structures to a second side of a micromechanical wafer.
Dependencies are inferred from the claim text.