Semiconductor structure and fabrication method thereof

Abstract

The embodiments relate to a semiconductor structure and a fabrication method thereof. The fabrication method includes: providing a wafer, in the wafer there being provided with a scribe line, in the scribe line there being provided with a test pad, a first test structure, and a second test structure; the second test structure being positioned below the first test structure, and a transverse pitch between the second test structure and the first test structure being at least equal to a width of the test pad; forming a protective layer on the wafer, the protective layer at least covering the scribe line; and performing exposure and development on the protective layer, such that a thickness of the protective layer remained above the first test structure is greater than that of the protective layer remained above the second test structure.

Dependencies are inferred from the claim text.