Apparatus for sensing wafer loading state using sound wave sensor

Abstract

Disclosed herein is an apparatus for sensing a wafer loading state using a sound wave sensor, including: a wafer loading part into which a wafer is loaded or unloaded along a slot; a sound wave sensor installed to be spaced apart from the slot, and sensing a contact sonic wave generated due to contact when the wafer is loaded or unloaded to generate real-time waveform information; and a control module confirming whether the wafer is normally loaded into the slot, wherein the control module includes: a control reception part receiving the real-time waveform information; a control memory in which a look-up table including look-up waveform information is stored; and a control determination part determining whether the wafer is normally loaded by comparing the real-time waveform information with the look-up waveform information.

Dependencies are inferred from the claim text.