Semiconductor manufacturing equipment and semiconductor manufacturing method

Semiconductor manufacturing equipment configured to perform processing for manufacturing a semiconductor on a wafer, the semiconductor manufacturing equipment comprising

• a thickness calculation function,
• the thickness calculation function including
• a measurement value acquisition unit configured to acquire a plurality of measurement values at different measurement positions of the wafer from a thickness measurement function configured to measure a thickness of the wafer or a thickness measurement object deposited on the wafer along a surface of the wafer,
• a histogram data creation unit configured to create histogram data based on the plurality of measurement values, and
• a grade group extraction unit configured to extract a grade group from the histogram data,
• the grade group including sequential grades having frequencies equal to or greater than a predetermined frequency,
• the thickness calculation function further including a representative value calculation unit configured to calculate a representative value of a thickness of a measurement region based on the grades included in the extracted grade group.