Wafer chuck
AssigneeSamsung Electronics Co., Ltd.
InventorsSungil CHOI, Hyeondong SONG, Myeongshik SHIM, Jonghyun HONG, Bonggyo SEO
Life of this patent
Estimating the term…
Abstract
A wafer chuck includes a body portion; a vacuum barrier portion including a wall structure arranged at the same distance from a center point of the body portion; f protrusions arranged inside and outside the vacuum barrier portion, protruding from a top surface of the body portion and spaced apart from each other; and a vacuum portion including vacuum holes spaced apart from each other penetrating the body portion inside the vacuum barrier portion.
Claims20
A wafer chuck comprising:
- a body portion;
- a vacuum barrier portion including a wall structure arranged at the same distance from a center point of the body portion;
- protrusions inside and outside the vacuum barrier portion, protruding from a top surface of the body portion and spaced apart from each other;
- and
- a vacuum portion including vacuum holes spaced apart from each other penetrating the body portion inside the vacuum barrier portion.
A wafer chuck comprising:
- a body portion;
- a vacuum barrier portion including a wall structure arranged at the same distance from a center point of the body portion;
- protrusions inside and outside the vacuum barrier portion, protruding from a top surface of the body portion and spaced apart from each other,
- wherein the protrusions are arranged along virtual circles, the virtual circles having a central point at the center point of the body portion, and two adjacent protrusions on one of the virtual circles and the closest adjacent protrusion on an adjacent virtual circle form a triangle, the triangle being an equidistant triangle;
- and
- a vacuum portion including vacuum holes spaced apart from each other penetrating the body portion inside the vacuum barrier portion, wherein the vacuum holes are at a center portion of the body portion and at an inner peripheral portion of the vacuum barrier portion.
The wafer chuck of claim of 10, wherein the protrusions include
- first protrusions spaced apart from each other along a first virtual circle at a first distance from the center point of the body portion and
- second protrusions spaced apart from each other along a second virtual circle spaced apart from the first virtual circle by a radiation pitch, and
- one of the first protrusion and the second protrusions closest to the one of the first protrusion form the triangle.
A wafer chuck comprising:
- a body portion;
- a paddle insertion portion including an insertion groove into which a wafer transfer paddle is configured to be inserted, on one side of the body portion;
- a vacuum barrier portion including a wall structure spaced apart from a center point of the body portion, on the body portion except for the paddle insertion portion, and at the same distance from the center point of the body portion;
- protrusions inside and outside the vacuum barrier portion, protruding from a top surface of the body portion and spaced apart from each other;
- a central vacuum portion in a vicinity of a center portion inside of the vacuum barrier portion and including a first vacuum hole penetrating the body portion;
- and
- a peripheral vacuum portion in a vicinity of a periphery portion inside of the vacuum barrier portion and including second vacuum holes spaced apart from each other penetrating the body portion.
Dependencies are inferred from the claim text.