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US 2021/0079263 A1Published application
High molecular weight polyvinyl pyrrolidone for low-k removal rate suppresion
AssigneeFujimi Incorporated
InventorJimmy Erik GRANSTROM
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Abstract
Provided herein are compositions and methods for polishing surfaces comprising one or more low-k materials and optionally one or more additional materials (e.g., Cu, Ta, Co, Ni, etc.), e.g., in semiconductor device fabrication. Embodiments include a composition for chemical mechanical polishing of a surface comprising a low-k material (e.g., Black Diamond (BD)) the composition comprising an abrasive, a solvent, and a polymeric low-k suppressor.
Claims14
A chemical mechanical polishing slurry, comprising
- an abrasive;
- a solvent;
- and
- a polymeric low-k suppressor with Mw×C2>0.5 mg/mol, where Mw is weight average molecular weight and C is concentration,
- wherein the Mw is greater than 4 kg/mol and the concentration of polymeric low-k suppressor is ≥0.01 wt-%.
2 more elements
Dependencies are inferred from the claim text.