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US 2021/0062041 A1Published application
Polishing liquid, polishing liquid set, and polishing method
AssigneeHitachi Chemical Company, Ltd.
InventorsKeita ARAKAWA, Daisuke IIKURA
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Abstract
A polishing liquid containing abrasive grains, a quaternary phosphonium cation, and a liquid medium, in which the abrasive grains contain at least one selected from the group consisting of a metal hydroxide and cerium oxide, and the quaternary phosphonium cation has a hydrocarbon group having two or more carbon atoms which is bonded to a phosphorus atom.
Claims30
A polishing liquid comprising:
- abrasive grains;
- a quaternary phosphonium cation;
- and
- a liquid medium, wherein
- the abrasive grains contain a metal hydroxide, and
- the quaternary phosphonium cation has a hydrocarbon group having two or more carbon atoms which is bonded to a phosphorus atom.
3 more elements
A polishing liquid comprising:
- abrasive grains;
- a quaternary phosphonium cation;
- and
- a liquid medium, wherein
- the abrasive grains contain cerium oxide, and
- the quaternary phosphonium cation has a hydrocarbon group having two or more carbon atoms which is bonded to a phosphorus atom.
3 more elements
(canceled)
Dependencies are inferred from the claim text.