Forming iii nitride alloys
AssigneeKing Abdullah University of Science and Technology
InventorsXiaohang LI, Kaikai LIU
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AssigneeKing Abdullah University of Science and Technology
InventorsXiaohang LI, Kaikai LIU
Estimating the term…
A method for forming a semiconductor device involves selecting a substrate on which a wurtzite III-nitride alloy layer will be formed, and a piezoelectric polarization and an effective piezoelectric coefficient for the wurtzite III-nitride alloy layer. It is determined whether there is a wurtzite III-nitride alloy composition satisfying the selected effective piezoelectric coefficient. It is also determined whether there is a thickness for a layer formed from the wurtzite III-nitride alloy composition satisfying the selected piezoelectric polarization based on the selected substrate and the selected effective piezoelectric coefficient. Responsive to the determination that there is a wurtzite III-nitride alloy composition having a lattice constant satisfying the selected effective piezoelectric coefficient and a thickness for the layer formed from the wurtzite III-nitride alloy composition satisfying the selected piezoelectric polarization, the wurtzite III-nitride alloy layer is formed on the substrate having the wurtzite III-nitride alloy composition satisfying the selected effective piezoelectric coefficient and having the thickness satisfying the selected piezoelectric polarization.
A method for forming a semiconductor device, the method comprising:
A method for forming a wurtzite III-nitride layer having an effective piezoelectric coefficient within a desired effective piezoelectric coefficient range, the method comprising:
A method for forming a semiconductor device, the method comprising:
Dependencies are inferred from the claim text.