Apparatus for and Method Cleaning a Support Inside a Lithography Apparatus

An apparatus comprising:

• a substrate configured to be supported by a first support structure, the substrate comprising
• at least one electrode configured to generate an electrostatic field between the at least one electrode and a confronting surface of a second support structure when the first support structure brings the surface of the substrate into spaced-apart apposition with the confronting surface of the second support structure;
• wherein the at least one electrode is electrically connected to a voltage supply.

The apparatus of claim 25, wherein the first support structure is a wafer support.

The apparatus of claim 25, wherein the first support structure is a reticle support.

The apparatus of claim 25, wherein the second support structure comprises a chuck and a clamp supported by the chuck.

The apparatus of claim 25, wherein the voltage supply is part of the substrate.

The apparatus of claim 25, wherein the substrate includes a switch for selectively connecting the electrode to the voltage supply.

The apparatus of claim 25, wherein the at least one electrode has a total area substantially the same as a total area of the confronting surface.

The apparatus of claim 25, wherein the surface of the substrate in proximity to the confronting surface is substantially planar.

The apparatus of claim 25, wherein the confronting surface has a nonplanar surface and the surface of the substrate in proximity to the confronting surface has a substantially complementary nonplanar surface.

The apparatus of claim 25, wherein the substrate has a layer comprises a material that is substantially nonconductive.

The apparatus of claim 25, wherein the substrate has a layer comprises a material that is substantially semiconductive.

The apparatus of claim 25, wherein the substrate has a layer of an adherent material on a surface of the substrate which confronts the confronting surface.