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US 2020/0288598 A1Published application
Electronics cooling using bimetal
OwnerMeisam MEHRAVARAN, Sungyong BANGinventors
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Abstract
Embodiments are disclosed of an apparatus including a first enclosure having an interior that is at a first temperature and a second enclosure having an interior that is at a second temperature. An opening allows fluid to flow between the interior of the first enclosure and the interior of the second enclosure. A bimetal valve is positioned in the opening to regulate fluid flow between the first enclosure and the second enclosure depending on the first temperature or on the difference between the first temperature and the second temperature.
Claims17
An apparatus comprising:
- a first enclosure having an interior that is at a first temperature;
- a second enclosure having an interior that is at a second temperature;
- an opening to allow fluid to flow between the interior of the first enclosure and the interior of the second enclosure;
- and
- a bimetal valve positioned in the opening to regulate fluid flow between the first enclosure and the second enclosure depending on the first temperature or on the difference between the first temperature and the second temperature.
2 more elements
A system comprising:
- a vehicle;
- an electronics compartment positioned within the vehicle, an interior of the electronics compartment being at a first temperature;
- a cooling duct positioned within the vehicle, an interior of the cooling duct being at a second temperature;
- an opening to allow fluid to flow from the cooling duct into the electronics ;
- and
- a bimetal valve positioned in the opening to regulate fluid flow between the cooling duct and the electronics compartment depending on the first temperature or on the difference between the first temperature and the second temperature.
3 more elements
Dependencies are inferred from the claim text.