Wafer placement apparatus
AssigneeNGK Insulators, Ltd.
InventorJoyo ITO
Life of this patent
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Abstract
A wafer placement apparatus includes a ceramic plate having a top surface including a wafer placement surface, the ceramic plate allowing at least one of an electrostatic electrode and a heater electrode to be embedded therein; and a cooling plate disposed on an undersurface of the ceramic plate opposite to the wafer placement surface to cool the ceramic plate, wherein the cooling plate includes a coolant channel, and the coolant channel has a multi-layer structure at least partially including two or more layers stacked vertically, the two or more layers being spaced different distances apart from the wafer placement surface.
Claims8
A wafer placement apparatus, comprising:
- a ceramic plate having a top surface including a wafer placement surface, the ceramic plate allowing at least one of an electrostatic electrode and a heater electrode to be embedded therein;
- and
- a cooling plate disposed on an undersurface of the ceramic plate opposite to the wafer placement surface to cool the ceramic plate,
- wherein the cooling plate includes a coolant channel, and the coolant channel has a multi-layer structure at least partially including two or more layers stacked vertically, the two or more layers being spaced different distances apart from the wafer placement surface.
Dependencies are inferred from the claim text.