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AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChia-Yuan Chen, Hung-Jen Lu, Ming-Hsien Lee, Po-Tao Chu
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The present disclosure, in some embodiments, relates to a method of transporting a semiconductor wafer. The method includes transferring a semiconductor wafer into a first wafer slot of a second plurality of wafer slots within an adaptive inset. The adaptive inset is arranged within an interior cavity of a wafer cassette having a first plurality of wafer slots while transferring the semiconductor wafer into the first wafer slot. The wafer cassette and the adaptive inset are transported into a loading port of a semiconductor processing tool configured to perform a fabrication process on the semiconductor wafer.
A method of transporting a semiconductor wafer, comprising:
A method of transporting semiconductor substrates, comprising:
A method of transporting semiconductor substrates, comprising:
Dependencies are inferred from the claim text.