Micro-vacuum module for semiconductor device transfer and method for transferring semiconductor device using the micro-vacuum module

A method for fabricating a micro-vacuum module for semiconductor device transfer, comprising:

• forming a hole array serving as holes for forming micro-vacuum on a base substrate;
• attaching the base substrate onto a carrier substrate using a sacrificial layer;
• forming a pattern layer capable of covering the hole array formed on the base substrate;
• attaching a process substrate having through-holes connected to an external pump module and a vacuum control unit to the base substrate;
• and
• removing the sacrificial layer and the pattern layer.

A method for fabricating a micro-vacuum module for semiconductor device transfer, comprising:

• forming a material that can be used as a sacrificial layer on a carrier substrate;
• forming a hole array serving as holes for forming micro-vacuum on the sacrificial layer;
• forming a channel in a direction not covering the hole array formed on the carrier substrate;
• attaching the carrier substrate with the channel formed to a process substrate;
• and
• separating the carrier substrate by removing the sacrificial layer.

A method for fabricating a micro-vacuum module for semiconductor device transfer, comprising:

• forming a channel on a base substrate;
• forming a hole array with a predetermined interval corresponding to the channel formed on the base substrate;
• and
• attaching a process substrate with through-holes connected to an external pump module and a vacuum control unit formed to the base substrate.