Method for lower thermal budget multiple cures in semiconductor packaging

Abstract

A multilayer structure comprises: a substrate; and, a plurality of polymerizable layers successively deposited on the substrate, with each successive layer having a greater dielectric polarizability than the preceding layer(s), so that each successive layer will absorb microwave energy preferentially to the preceding layer(s). In this way, successive layers can be cured without over-curing the preceding layers. The individual layers are preferably materials from a single chemical family (e.g., epoxies, polyimides, PBO, etc.) and have similar properties after curing. The dielectric polarizabilities may be adjusted by modifying such factors as chain endcap dipole strength, cross-linker dipole strength, promoter, solvent, and backbone type. The invention is particularly suitable for producing various polymer layers on silicon for electronic applications. An associated method is also disclosed.

Dependencies are inferred from the claim text.