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US 2019/0295857 A1Published application
Carrier substrate for a semiconductor device and a method for forming a carrier substrate for a semiconductor device
AssigneeIntel IP Corporation
InventorsSonja Koller, Georg Seidemann, Bernd Waidhas
Life of this patent
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Abstract
A method for forming a carrier substrate for a semiconductor device, the method includes providing a substrate layer including conductive particles embedded in an electrically insulating material and localized heating of the substrate layer along a desired trace by a laser to form a conductive trace of merged particles along the desired trace.
Claims25
A method for forming a carrier substrate for a semiconductor device, the method comprising:
- providing a substrate layer comprising conductive particles embedded in an electrically insulating material;
- and
- localized heating of the substrate layer along a desired trace by a laser to form a conductive trace of merged particles along the desired trace.
A carrier substrate for a semiconductor device, the carrier substrate comprising:
- conductive particles embedded in an electrically insulating material layer;
- and
- at least one conductive trace of merged particles embedded in the electrically insulating material layer.
A semiconductor device comprising:
- a carrier substrate comprising conductive particles embedded in an electrically insulating material layer and a conductive trace of merged conductive particles;
- and
- a semiconductor die electrically connected to the conductive trace.
Dependencies are inferred from the claim text.