Semiconductor wafer having bevel portion

A semiconductor wafer comprising:

• a wafer body including a first surface and a second surface opposite the first surface;
• and
• a bevel portion provided along an outer circumference of the wafer body, the bevel portion including an inclined surface connecting the first surface and the second surface,
• wherein the bevel portion meets the first surface at a first point, the bevel portion meets the second surface at a second point, and an outermost portion of the inclined surface corresponds to a third point configured to contact an external contact member, and
• wherein a bevel length is formed between a first virtual straight line extending from the first point to the second point and a second virtual straight line contacting the third point and parallel to the first virtual straight line.

A semiconductor wafer comprising:

• a wafer body including a first surface and a second surface opposite the first surface;
• a notch portion provided along an outer circumference of the wafer body towards a center portion of the wafer body, and
• a bevel portion provided along the outer circumference of the wafer body, the bevel portion including an inclined surface connecting the first surface and the second surface,
• wherein the bevel portion meets the first surface at a first point, the bevel portion meets the second surface at a second point, and an outermost portion of the inclined surface corresponds to a third point configured to contact an external contact member,
• wherein the inclined surface is located within a virtual circle circumscribing the third point, a center of the virtual circle being located in the wafer body, and
• wherein a first bevel angle is formed between the first surface and a first tangent line contacting the bevel portion at the first point.