Devices, systems and methods for electrostatic force enhanced semiconductor bonding
AssigneeMicron Technology, Inc.
InventorsShu Qin, Ming Zhang
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Abstract
Various embodiments of microelectronic devices and methods of manufacturing are described herein. In one embodiment, a method for enhancing wafer bonding includes positioning a substrate assembly on a unipolar electrostatic chuck in direct contact with an electrode, electrically coupling a conductor to a second substrate positioned on top of the first substrate, and applying a voltage to the electrode, thereby creating a potential differential between the first substrate and the second substrate that generates an electrostatic force between the first and second substrates.
Claims20
A method for enhancing wafer bonding, the method including:
- positioning a substrate assembly on a unipolar electrostatic chuck (“ESC”), the ESC having an electrode;
- positioning a first substrate of the substrate assembly on the electrode, wherein the substrate assembly further includes a second substrate on the first substrate;
- electrically coupling a conductor to the second substrate;
- applying a voltage to the electrode, thereby creating an electrical potential between the first substrate and the second substrate.
A system for enhancing bonding between a first substrate and a second substrate, the system comprising:
- a unipolar electrostatic chuck configured to receive the first substrate, the chuck including a dielectric base and an electrode at least partially within the dielectric base, wherein a top surface of the electrode is configured to directly electrically contact the first substrate;
- a conductor configured to be electrically coupled to the second substrate;
- and
- a power supply electrically coupled to the electrode and conductor, respectively, to apply an electrical bias between the electrode and conductor.
A method for enhancing wafer bonding utilizing a unipolar electrostatic chuck, the electrostatic chuck including an electrode, the method including:
- electrically coupling the electrode to a first substrate;
- electrically coupling a conductor to a second substrate positioned on the first substrate, wherein the first substrate and the second substrate are separated by a dielectric barrier;
- and
- exerting opposing forces on the top and bottom surfaces of the dielectric barrier.
Dependencies are inferred from the claim text.