Figurative models calibrated to correct errors in process models

A computer program product comprising:

• a computer readable storage medium readable by one or more processors and storing instructions for execution by a processor for performing a method comprising:
• selecting, by a processor, first stage input factors for utilization with and assigning each step in a litho simulation process to a first computer-implemented model;
• measuring, by the processor, pattern data from existing measured dimensions of a semiconductor to obtain values for the first stage input factors;
• calibrating, by the processor, the first computer-implemented model against the measured pattern data;
• applying, by the processor, the calibrated first computer-implemented model to predict printed dimensions from the values of the first stage input factors, wherein the printed dimensions from applying the calibrated first computer-implemented model comprise residuals;
• selecting, by the processor, based on the residuals, second stage input factors for a second computer-implemented model, wherein the selecting comprises assigning each step in the litho simulation process to the second computer-implemented model;
• calibrating, by the processor, the second computer-implemented model against the measured pattern data to predict deviations of predicted printed dimensions, from the printed dimensions from the values of the first stage input factors, by utilizing values of the second stage input factors;
• and
• producing, by the processor, the predicted printed dimensions of a lithographic pattern by using the second computer-implemented model to revise the printed dimensions of the first computer-implemented model.

A system comprising:

• a memory;
• a processor in communication with the memory;
• and
• program instructions executable by the processor via the memory to perform a method, the method comprising:
• selecting, by the processor, first stage input factors for utilization with and assigning each step in a litho simulation process to a first computer-implemented model;
• measuring, by the processor, pattern data from existing measured dimensions of a semiconductor to obtain values for the first stage input factors;
• calibrating, by the processor, the first computer-implemented model against the measured pattern data;
• applying, by the processor, the calibrated first computer-implemented model to predict printed dimensions from the values of the first stage input factors, wherein the printed dimensions from applying the calibrated first computer-implemented model comprise residuals;
• selecting, by the processor, based on the residuals, second stage input factors for a second computer-implemented model, wherein the selecting comprises assigning each step in the litho simulation process to the second computer-implemented model;
• calibrating, by the processor, the second computer-implemented model against the measured pattern data to predict deviations of predicted printed dimensions, from the printed dimensions from the values of the first stage input factors, by utilizing values of the second stage input factors;
• and
• producing, by the processor, the predicted printed dimensions of a lithographic pattern by using the second computer-implemented model to revise the printed dimensions of the first computer-implemented model.