Electronic apparatus

Abstract

An electronic apparatus which can achieve both a reduction in thickness of a chassis and an improvement in a heat releasing performance is provided. An electronic apparatus 10 includes a chassis 12 having an electronic component 18 arranged therein, a heat sink 20 which is provided in the chassis 12 and absorbs heat generated from the electronic component 18 when its one surface 20a is arranged to enable conduction of the heat from the electronic component 18, and a heat conducting sheet 22 which is arranged in the chassis 12, closely arranged on the other surface 20c on the side opposite to the one surface 20a of the heat sink, has an outer shape area larger than an outer shape area of the heat sink 20, and extends to the outside of an outer shape of the heat sink 20.

Dependencies are inferred from the claim text.