Wafer holder and temperature conditioning arrangement and method of manufacturing a wafer

13) A method of manufacturing a wafer coated with a layer, comprising

• providing in a vacuum process coating chamber a wafer holder and temperature conditioning arrangement comprising:
• a base arrangement with an extended essentially plane surface bordered by a protruding circular rim surface about a center of said essentially plane surface,
• a metal circular wafer carrier plate centrally mounted with respect to said center of said essentially plane surface, one surface of said metal circular wafer carrier plate, said extended essentially plane surface and said protruding circular rim surface commonly defining a heater compartment, said wafer carrier plate being drivingly rotatable about a geometric axis through said center of said extended essentially plane surface with respect to said base arrangement,
• a multitude of heater lamp tubes arranged in said heater compartment along said extended essentially plane surface and said one surface of said metal circular wafer carrier plate and directly exposed to said one surface of said metal circular wafer carrier plate and mounted to said base arrangement,
• an electric power control unit controlling power to said multitude of heater lamp tubes and conceived to operate said multitude of heater lamp tubes so as to establish along the other surface of said metal circular wafer carrier plate, opposite said one surface thereof, a predetermined temperature, averaged over said other surface,
• depositing on said other surface of said metal circular wafer carrier plate a wafer to be coated;
• drivingly rotating said metal circular wafer carrier plate while operating said electric power control unit to heat up said wafer to at least 800° C. and operating said heater compartment in vacuum atmosphere;
• and
• depositing a layer on said wafer.

15) A wafer holder and temperature conditioning arrangement to be mounted to a vacuum wafer treatment chamber, comprising

• a base arrangement with an extended, essentially plane surface bordered by a protruding circular rim surface about a center of said essentially plane surface;
• a metal circular wafer carrier plate mounted centered with respect to said center of said essentially plane surface, one surface of said metal circular wafer carrier plate, said extended, essentially plane surface and said protruding circular rim surface commonly defining a heater compartment, said metal circular wafer carrier plate being drivingly rotatable about a geometric axis through said center of said extended, essentially plane surface with respect to said base arrangement;
• a multitude of heater lamp tubes arranged in said heater compartment along said extended,
• essentially plane surface and along said one surface of said metal circular wafer carrier plate and directly exposed to said one surface of said metal circular wafer carrier plate and mounted to said base arrangement;
• wherein the surface of said base arrangement is a heat reflector.

27) A method of manufacturing a wafer coated with a layer, comprising

• providing in a vacuum process coating chamber a wafer holder and temperature conditioning arrangement comprising:
• a base arrangement with an extended essentially plane surface bordered by a protruding circular rim surface about a center of said essentially plane surface,
• a metal circular wafer carrier plate centrally mounted with respect to said center of said essentially plane surface, one surface of said metal circular wafer carrier plate, said extended essentially plane surface and said protruding circular rim surface commonly defining a heater compartment, said wafer carrier plate being drivingly rotatable about a geometric axis through said center of said extended essentially plane surface with respect to said base arrangement,
• a multitude of heater lamp tubes arranged in said heater compartment along said extended essentially plane surface and said one surface of said metal circular wafer carrier plate and directly exposed to said one surface of said metal circular wafer carrier plate and mounted to said base arrangement, wherein the surface of said base arrangement is a heat reflector,
• an electric power control unit controlling power to said multitude of heater lamp tubes and conceived to operate said multitude of heater lamp tubes so as to establish along the other surface of said metal circular wafer carrier plate, opposite said one surface thereof, a predetermined temperature, averaged over said other surface,
• depositing on said other surface of said metal circular wafer carrier plate a wafer to be coated;
• drivingly rotating said metal circular wafer carrier plate while operating said electric power control unit to heat up said wafer to at least 800° C.;
• and
• depositing a layer on said wafer.